JPH0252377U - - Google Patents
Info
- Publication number
- JPH0252377U JPH0252377U JP12864088U JP12864088U JPH0252377U JP H0252377 U JPH0252377 U JP H0252377U JP 12864088 U JP12864088 U JP 12864088U JP 12864088 U JP12864088 U JP 12864088U JP H0252377 U JPH0252377 U JP H0252377U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electronic component
- hole
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12864088U JPH0252377U (en]) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12864088U JPH0252377U (en]) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252377U true JPH0252377U (en]) | 1990-04-16 |
Family
ID=31382171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12864088U Pending JPH0252377U (en]) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252377U (en]) |
-
1988
- 1988-09-30 JP JP12864088U patent/JPH0252377U/ja active Pending